AttributeKey09: Lead Free Solder Processes

Products with this attribute (2 total)

1-1437381-7 TE Connectivity Always EU RoHS/ELV Compliant Not applicable for solder process capability

1-1542005-3 TE Connectivity Heat Sink; BGA; Package Size = 21 [.827] mm [in]; For Use With BGA Semiconductor Packages; Power Air Velocity Thermal Resistance;