snippet: 1-1542005-3 TE Connectivity Heat Sink; BGA; Package Size = 21 [.827] mm [in]; For Use With BGA Semiconductor Packages; Power Air Velocity Thermal Resistance;
Products with this attribute (1 total)
1-1542005-3 TE Connectivity Heat Sink; BGA; Package Size = 21 [.827] mm [in]; For Use With BGA Semiconductor Packages; Power Air Velocity Thermal Resistance;