snippet: <p><strong>Pace Technologies, WCBN-0085, 8" Cubic Boron Nitride Wafering Blade (Medium Grit, High Concentration), 1/2" Arbor </strong> </p> <p>Precision wafer cutting is used for sectioning very delicate samples or for sectioning a sample to a very precise location. </p> <p><strong>Features: </strong> </p> <ul><li>High concentration - 100% </li> <li>Medium grit - 60-70 micon (220 grit) </li> </ul> <p><strong>Application: </strong> </p> <ul><li>General purpose and metals </li> </ul>

Products with this attribute (1 total)