Attributes

Key Value
CategorySoldering, Desoldering,.
Inner Dimension0.394" L x 0.394" W (10.
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions52
Outer Dimension1.300" L x 0.900" W (33.
PackageBulk
Pitch0.026" (0.65mm)
Product StatusActive
SeriesProto-Advantage IPC
Thermal Center Pad0.276" L x 0.276" W (7..
Thickness0.0040" (0.102mm)
TypeHTQFP
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