Attributes

Key Value
CategorySoldering, Desoldering,.
CompositionSn96.5Ag3Cu0.5 (96.5/3/.
Diameter0.018" (0.46mm)
Flux Type-
FormJar
Melting Point423 ~ 428?F (217 ~ 220?.
MfrChip Quik Inc.
PackageBulk
Part StatusActive
ProcessLead Free
SeriesSMD2
Shelf Life24 Months
Shelf Life StartDate of Manufacture
Shipping Info-
Storage/Refrigeration T.-
TypeSolder Sphere
Weight-
Wire Gauge-
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