Description:
<p>The CircuitMedic B4-360-2323-100 is a flextac rework stencils with a pitch of 1.</p><b>The CircuitMedic B4-360-2323-100 Features: </b><br><ul><li>Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed</li><li>Laser cut ensures precise aperture size</li><li>Disposable - eliminates tedious stencil cleaning</li><li>Flexible - conforms to board surface</li><li>Fold-up sides for easy placement and solder paste containment</li><li>Low cost</li><li>Packaged in a handy ESD safe carrying case<br></ul><b>The CircuitMedic B4-360-2323-100 Specifications: </b><br><ul><li> Product Type: Flextac Rework Stencils<li> Applications: Applying Solder Paste for BGA Rework<li> Type of Stencil: Flextac Rework<li> Thickness: 0.004in<li> Aperture Size: 0.02in<li> Pitch: 1mm<li> Material: Polymer Film<li> Material Category: Plastic<li> Component Size: 23 x 23mm<li> Component Length: 23mm<li> Component Width: 23mm<li> Number of Balls: 360<li> Ball Pattern: 22 x 22 P5-Row<li> Package Quantity: 10PK</ul>