Key ^ | Value |
---|---|
Chipset Validation, Product Longevity Program Start Date | N/A |
FBGA_Code | NW197 |
In-stock | 33 |
Op. Temp. | 0C to +70C |
Package/Case | BGA |
Pin Count | 63-ball |
Product Categories | NAND Flash ; SLC NAND |
Product Longevity Program | No |
RoHs Status | Lead free/RoHS Compliant |