NXP USA Inc. LPC55S66JBD100K

mpnLPC55S66JBD100K
brandname: NXP USA Inc.
manufacturername: NXP USA Inc.

Attributes

Key	Value
Categories	Integrated Circuits (I.
Connectivity	Flexcomm, I?C, MMC/SD/.
Core Processor	ARM? Cortex?-M33
Core Size	32-Bit
Data Converters	A/D 10x16b
EEPROM Size	-
Lead Free Status / RoHS.	Lead free / RoHS Compl.
Manufacturer	NXP USA Inc.
Manufacturer Part Number	LPC55S66JBD100K
Manufacturer Standard L.	12 Weeks
Moisture Sensitivity Le.	3 (168 Hours)
Mounting Type	Surface Mount
Number of I/O	64
Operating Temperature	-40?C ~ 105?C (TA)
Oscillator Type	Internal
Package / Case	100-LQFP Exposed Pad
Packaging	Tray
Peripherals	Brown-out Detect/Reset.
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
RAM Size	144K x 8
Series	LPC55S6x