prev
NXP USA Inc. MC9S08QG4CFKE
NXP USA Inc.zoom
manufacturer:

Attributes

Key ^Value
ConnectivityI?C, SCI, SPI
Core ProcessorS08
Core Size8-Bit
Data ConvertersA/D 8x10b
EEPROM Size-
MfrNXP USA Inc.
Mounting TypeSurface Mount
Number of I/O12
Operating Temperature-40?C ~ 85?C (TA)
Oscillator TypeInternal
Package / Case24-VFQFN Exposed Pad
Part StatusActive
PeripheralsLVD, POR, PWM, WDT
Program Memory Size4KB (4K x 8)
Program Memory TypeFLASH
RAM Size256 x 8
Speed20MHz
Supplier Device Package24-QFN-EP (4x4)
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V