NXP USA Inc. MC9S12XDP512CAG

mpnMC9S12XDP512CAG
brandname: NXP USA Inc.
manufacturername: NXP USA Inc.

Attributes

Key	Value
Base Product Number	MC9S12
Category	Integrated Circuits (IC.
Connectivity	CANbus, EBI/EMI, I?C, I.
Core Processor	HCS12X
Core Size	16-Bit
Data Converters	A/D 24x10b
EEPROM Size	4K x 8
Mfr	NXP USA Inc.
Mounting Type	Surface Mount
Number of I/O	119
Operating Temperature	-40?C ~ 85?C (TA)
Oscillator Type	External
Package	Tray
Package / Case	144-LQFP
Part Status	Active
Peripherals	LVD, POR, PWM, WDT
Program Memory Size	512KB (512K x 8)
Program Memory Type	FLASH
RAM Size	32K x 8
Series	HCS12X
Speed	80MHz
Supplier Device Package	144-LQFP (20x20)
Voltage - Supply (Vcc/V.	2.35V ~ 5.5V