| Construction, Package Description | Chip |
| Direct Alternates | NRC02F62R0TR10F |
| JESD-609 Code | e3 |
| Manufacturer | ROHM Semiconductor |
| Manufacturer Part Number | MCR006YRTF62R0 |
| Mounting Feature | SURFACE MOUNT |
| Number of Terminals | 2 |
| Operating Temperature-Max | 125 ?C |
| Operating Temperature-Min | -55 ?C |
| Package Height | 230 ?m |
| Package Length | 600 ?m |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 300 ?m |
| Packaging | - |
| Packing Method | TR, PAPER, 7 INCH |
| Pbfree Code | Yes |
| Rated Power Dissipation (P) | 50 mW |
| Rated Temperature | 70 ?C |
| Reference Standard | TS 16949 |
| Resistance | 62 ? |