| Applications, Contact Finish Thickness - Post, Features, Ingress Protection, Mated Stacking Heights, Voltage Rating | - |
| Base Product Number | ESQT-123 |
| Category | Connectors, Interconnects |
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10.0?in (0.25?m) |
| Contact Length - Post | 0.083" (2.11mm) |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5A per Contact |
| Description | CONN SOCKET 115P 0.079 GOLD PCB |
| Detailed Description | 115 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold |
| Digi-Key Part Number | ESQT-123-03-L-5-375-ND |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.375" (9.53mm) |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Manufacturer Product Number | ESQT-123-03-L-5-375 |
| Manufacturer, Mfr | Samtec Inc. |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 115 |
| Number of Positions Loaded | All |
| Number of Rows | 5 |
| Operating Temperature | -55?C ~ 125?C |
| Package | Bulk |
| Pitch - Mating, Row Spacing - Mating | 0.079" (2.00mm) |
| Product Status | Active |
| Series | ESQT |
| Style | Board to Board or Cable |
| Termination | Solder |