| Applications, Contact Finish Thickness - Post, Features, Ingress Protection, Mated Stacking Heights, Voltage Rating | - |
| Base Product Number | ESQT-127 |
| Category | Connectors, Interconnects |
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 3.00?in (0.076?m) |
| Contact Length - Post | 0.149" (3.78mm) |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5A per Contact |
| Description | CONN SOCKET 108P 0.079 GOLD PCB |
| Detailed Description | 108 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold |
| Digi-Key Part Number | ESQT-127-03-FM-Q-309-ND |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.309" (7.85mm) |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Manufacturer Product Number | ESQT-127-03-FM-Q-309 |
| Manufacturer, Mfr | Samtec Inc. |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 108 |
| Number of Positions Loaded | All |
| Number of Rows | 4 |
| Operating Temperature | -55?C ~ 125?C |
| Package | Bulk |
| Pitch - Mating, Row Spacing - Mating | 0.079" (2.00mm) |
| Product Status | Active |
| Series | ESQT |
| Style | Board to Board or Cable |
| Termination | Solder |