| Key | Value |
|---|---|
| Base Product Number | HSEC8-180 |
| Card Thickness | 0.062" (1.57mm) |
| Card Type | Non Specified - Dual Edge |
| Category | Connectors, Interconnects |
| Color | Black |
| Contact Finish | Gold |
| Contact Finish Thickness | 10.0?in (0.25?m) |
| Contact Material | Beryllium Copper |
| Contact Type | Cantilever |
| Features | Board Guide, Solder Retention |
| Flange Feature | - |
| Gender | Female |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Mfr | Samtec Inc. |
| Mounting Type | Surface Mount |
| Number of Positions | 160 |
| Number of Positions/Bay/Row | 80 |
| Number of Rows | 2 |
| Operating Temperature | -55?C ~ 125?C |
| Package | Tray |
| Pitch | 0.031" (0.80mm) |
| Product Status | Active |
| Read Out | Dual |
| Series | Edge Rate? HSEC8 |
| Termination | Solder |