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TE Connectivity (TE) 1871865-1

Attributes

Key ^Value
Accepts Wire Insulation Diameter Range3.4 ? 3.8?mm?[?.134 ? .15?in?]
Extension Below Board2.7?mm?[?.106?in?]
Height Above PC Board4?mm?[?.159?in?]
Mounting StyleStud Mount
Operating Temperature Range-40 ? 105??C?[?-40 ? 221??F?]
Packaging MethodReel
PCB Hole Diameter2.5 ? 2.6?mm?[?.098 ? .102?in?]
PCB Thickness (Recommended)1.6?mm?[?.063?in?]
Plating MaterialTin
Stud HoleNo
Terminal Angle, Terminal OrientationStraight
Terminal SizeMiniature
Terminal, Terminal TypeReceptacle
Terminates ToPrinted Circuit Board
Termination MethodCrimp
Underplating MaterialBrass
Wire Insulation Diameter (Max)3.8?mm?[?.15?in?]
Wire Insulation SupportWith
Wire Size2.2, 14