Assembly Process Feature | None |
Board-to-Board Configuration | Vertical |
Centerline (Pitch) | 1.27?mm?[?.05?in?] |
Circuit Application | Signal |
Connector | Printed Circuit Board |
Connector Mounting Type | Board Mount |
Connector Profile | Standard |
Connector System | Board-to-Board |
Contact Base Material | Phosphor Bronze |
Contact Current Rating (Max) | 1 |
Contact Mating Area Plating Material | Gold Flash |
Contact Mating Area Plating Material Finish | Matte |
Contact Mating Area Plating Material Thickness | .76??m?[?30??in?] |
Contact Shape | Square |
Contact Type | Pin |
Housing Material | Matte |
Mating Alignment | With |
Mating Alignment Type | Guide Post |
Number of Positions | 100 |
Number of Rows | 4 |
Operating Temperature Range | -55 ? 105??C?[?-67 ? 221??F?] |
Packaging Method | Tube |
Packaging Quantity | 54 |
PCB Connector Assembly Type | PCB Mount Header |
PCB Contact Termination Area Plating Material | Tin |
PCB Contact Termination Area Plating Material Finish | Matte |
PCB Mount Alignment | With |
PCB Mount Orientation | Vertical |
PCB Mount Retention | With |
PCB Mount Retention Type | Boardlock, Retention Leg |
PCB Thickness (Recommended) | .8 ? 1.6?mm?[?.76?in?] |
Row-to-Row Spacing | 1.904?mm?[?.0748?in?] |
Sealable | No |
Stackable | No |
Termination Method to Printed Circuit Board | Through Hole - Solder |
Termination Post | 2.54?mm?[?.1?in?] |
UL Flammability Rating | UL 94V-0 |