| Board-to-Board Configuration | Vertical |
| Boss | Yes |
| Busbar Mating Area Plating Thickness | 750 |
| Centerline (Pitch)?:</span> <em class="feature-value">1.27?mm?[?.05?in | 1.27?mm?[?.05?in?] |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector System | Board-to-Board |
| Contact Base Material | Phosphor Bronze |
| Contact Current Rating (Max) | 1 |
| Contact Layout | Matrix |
| Contact Mating Area Plating Material | Gold Flash |
| Contact Mating Area Plating Material Finish | Matte |
| Contact Mating Area Plating Thickness?:</span> <em class="feature-value">.76??m?[?30??in | .76??m?[?30??in?] |
| Contact Shape | Square |
| Contact Type | Pin |
| Dielectric Withstanding Voltage | 750 |
| Insulation Resistance | 4 |
| Mating Alignment | With |
| Mating Alignment Type | Guide Post |
| Number of Positions | 120 |
| Number of Rows | 4 |
| PCB Connector Assembly Type | PCB Mount Header |
| PCB Contact Termination Area Plating Material | Tin |
| PCB Contact Termination Area Plating Thickness?:</span> <em class="feature-value">3.81??m?[?149.9997??in | 3.81??m?[?149.9997??in?] |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | With |
| PCB Mount Retention Type | Boardlock, Retention Leg |
| PCB Retention Feature Material | Brass |
| PCB Retention Feature Plating Material | Tin-Copper over Nickel |
| Product Type | Connector |
| Profile | Standard |
| Row-to-Row Spacing?:</span> <em class="feature-value">1.904?mm?[?.0748?in | 1.904?mm?[?.0748?in?] |
| Sealable | No |
| Series | Series I |
| Solder Tail Contact Plating Material Finish | Matte |
| Stackable | No |
| Termination Method to Printed Circuit Board | Through Hole |
| Termination Post Length?:</span> <em class="feature-value">2.54?mm?[?.1?in | 2.54?mm?[?.1?in?] |
| Voltage | 250 |