Attributes

Key Value
Assembly Process FeatureMatte
Board-to-Board Configur.Vertical
Centerline (Pitch)1.27?mm?[?.05?in?], Boa.
Circuit Application-55 ? 105??C?[?-67 ? 22.
ConnectorPrinted Circuit Board
Connector Mounting TypeWith
Connector Profile750
Connector SystemBoard-to-Board
Contact Base MaterialBrass
Contact Current Rating .Pin
Contact Layout3.81??m?[?149.9997??in?]
Contact Mating Area Pla.Matte
Contact Mating Area Pla.Tin
Contact Mating Area Pla.Gold Flash
Contact ShapeMatte
Contact Type30
Dielectric Withstanding.4
Header TypeShrouded
Housing ColorLocating Posts
Housing Material1.27?mm?[?.05?in?]
Insulation Resistance4
Mating AlignmentThrough Hole - Solder
Mating Alignment TypeBoardlock, Retention Leg
Number of Positions160
Number of Rows4
Operating Temperature R.Black
Operating Voltage250
Packaging MethodUL 94V-0
Packaging QuantitySignal
PCB Connector Assembly .PCB Mount Header
PCB Contact Termination.Phosphor Bronze
PCB Contact Termination.Square
PCB Contact Termination.1
PCB Mount AlignmentGuide Post
PCB Mount Alignment TypeWith
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Mount Retention Type2.54?mm?[?.1?in?]
PCB Retention Feature M.Tin-Copper over Nickel
PCB Retention Feature P.Standard
SealableNo
StackableNo
Termination Method to P.Matrix
Termination PostMatrix
UL Flammability RatingNone
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