| Assembly Process Feature | None |
| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch) | 1.27, 3.04, 6.09, .05, .12, .24 |
| Circuit Application | Power & Signal |
| Connector | Printed Circuit Board |
| Connector Height | 18.8?mm?[?.73884?in?] |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | 1.5 |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | .076??m?[?2.99212??in?] |
| Contact Shape | Round |
| Contact Type | Pin |
| Data Rate | 16 |
| Header Type | Header Only |
| Housing Color | Black |
| Housing Material | LCP (High Temp Thermoplastic) |
| Impedance | 100 |
| Mating Alignment, Mating Retention | With |
| Number of Loaded Positions, Number of Positions | 259 |
| Number of Pairs | 80 |
| Number of Power Positions, Operating Voltage | 0 |
| Number of Signal Positions | 8 |
| Operating Temperature Range | -55 ? 85??C?[?-67 ? 185??F?] |
| Packaging Method | Tray |
| Packaging Quantity | 24 |
| PCB Connector Assembly Type | PCB Mount Header |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Mount Alignment, PCB Mount Retention | Without |
| PCB Mount Orientation | Vertical |
| PCB Thickness (Recommended) | .06?mm?[?.8?in?] |
| Sealable | No |
| Stack Height | 19?mm?[?.748?in?] |
| Stackable | Yes |
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
| Termination Post | 1.45?mm?[?.057?in?] |
| UL Flammability Rating | UL 94V-0 |