| Circuit Application | Signal |
| Comment | Solder Dipped. |
| Connector | Printed Circuit Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | 3 |
| Contact Mating Area Plating Material | Gold over Copper |
| Contact Mating Area Plating Thickness | 50 |
| Contact Size | 22 |
| Contact Style | Long |
| Contact Type | Socket |
| For Use With | AMPLIMITE |
| High Current | No |
| Operating Temperature Range | -55 ? 125??C?[?-67 ? 257??F?] |
| Packaging Method | Package |
| Packaging Quantity | 1000 |
| Post Diameter | .018?mm?[?.46?in?] |
| Product Type | Contact |
| Socket Hood Material | Brass |
| Socket Hood Plating Material | Gold |
| Termination Post Length | .393?mm?[?9.98?in?] |