Centerline (Pitch), Row-to-Row Spacing | 2.54?mm?[?.1?in?] |
Circuit Application | Signal |
Connector | Plug, Printed Circuit Board |
Connector Mounting Type | Board Mount |
Connector System | Wire-to-Board |
Contact Current Rating (Max) | 1 |
Contact Mating Area Plating Material | Tin |
Header Type | Shrouded |
Housing Color | Gray |
Mating Retention | Without |
Number of Positions | 10 |
Number of Rows | 2 |
Operating Temperature Range | -65 ? 105??C?[?-85 ? 221??F?] |
PCB Mount Orientation | Vertical |
PCB Mount Retention | With |
PCB Mount Retention Type | Boardlock |
Product Type | Connector Assembly |
Termination Method to Printed Circuit Board | Through Hole - Solder |
Termination Method to Wire | Insulation Displacement Crimp (IDC) |