| Assembly Process Feature | -40 ? 125??C?[?-40 ? 257??F?] |
| Board-to-Board Configuration, PCB Mount Orientation | Vertical |
| Centerline (Pitch), Connector Mounting Type, PCB Mount Alignment | Without |
| Centerline (Pitch), Housing Material, Operating Temperature Range | 2?mm?[?.079?in?] |
| Circuit Application | Yes |
| Connector | Printed Circuit Board, Receptacle |
| Connector Height | LCP (Liquid Crystal Polymer) |
| Connector Length | 4.5?mm?[?.18?in?] |
| Connector Profile, Dielectric Withstanding Voltage (Max) | 650 |
| Connector System | Board-to-Board |
| Connector Width | Black |
| Contact Base Material | .20 x .40 |
| Contact Current Rating (Max) | Socket |
| Contact Layout, Termination Method to Printed Circuit Board | 1.27??m?[?50??in?] |
| Contact Mating Area Plating Material Finish | Nickel |
| Contact Mating Area Plating Material Thickness | Select Gold |
| Contact Mating Area Plating Material, PCB Contact Termination Area Plating Material Finish | Matte |
| Contact Type | .76??m?[?29.9212??in?] |
| Contact Underplating Material | Tin |
| Contact Underplating Material Thickness | 3 ? 5??m?[?118.11 ? 196.85??in?] |
| Header Type | Shrouded |
| High Temperature Compatible | 12?mm?[?.4724?in?] |
| Housing Color | Board Mount |
| Make First / Break Last | No |
| Mating Alignment | Inline |
| Number of Loaded Positions, Number of Positions | 12 |
| Number of Rows, PCB Contact Termination Area Plating Material Thickness | 2 |
| Operating Voltage | 125 |
| Packaging Method | Signal |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Phosphor Bronze |
| PCB Mount Retention | Surface Mount |
| Post Size | Standard |
| Row-to-Row Spacing | 4?mm?[?.157?in?] |
| UL Flammability Rating | Pick and Place Cover |