prev
TE Connectivity (TE) 2132615-2

Attributes

Key ^Value
Board-to-Board ConfigurationOrthogonal, Vertical
Centerline (Pitch)1.9?mm?[?.075?in?]
Circuit ApplicationSignal
ConnectorPrinted Circuit Board
Connector Height11.95?mm?[?.47?in?]
Connector Mounting TypeBoard Mount
Connector StylePlug
Connector SystemBoard-to-Board
Connector Width20.8?mm?[?.819?in?]
Contact Base MaterialCopper-Nickel-Silicon
Contact Current Rating (Max).75
Contact Length5.5?mm?[?.217?in?]
Contact Mating Area Plating MaterialGold
Contact Mating Area Plating Material Thickness.76??m?[?29.92??in?]
Contact ShapeDual Beam
Contact TypePin
Contact Underplating MaterialNickel
Data Rate20 ? 25
Guide Hardware, Mating RetentionWithout
Guide LocationUnguided
Housing ColorBlack
Housing MaterialLCP (Liquid Crystal Polymer)
Impedance100
Mating Alignment TypePolarization
Mating Alignment, PCB Mount RetentionWith
Number of Columns8
Number of Pairs32
Number of Positions96
Number of Rows12
Number of Signal Positions64
Operating Temperature Range-55 ? 85??C?[?-67 ? 185??F?]
Operating Voltage30
Packaging MethodBox & Tube, Tube
PCB Contact Termination Area Plating MaterialTin
PCB Contact Termination Area Plating Material FinishMatte
PCB Hole Diameter.39?mm?[?.015?in?]
PCB Mount OrientationVertical
PCB Mount Retention TypeAction/Compliant Tail
PCB Thickness (Recommended)3
Row-to-Row Spacing1.35?mm?[?.053?in?]
Sealable, StackableNo
ShroudedFully Shrouded
Termination Method to Printed Circuit BoardThrough Hole - Press-Fit
UL Flammability RatingUL 94V-0