Assembly Process Feature | None |
Board-to-Board Configuration | Mezzanine |
Centerline (Pitch) | .64?mm?[?.025?in?] |
Circuit Application | Signal |
Connector | Printed Circuit Board |
Connector Height | 6.096?mm?[?.24?in?] |
Connector Mounting Type | Board Mount |
Connector System | Board-to-Board |
Connector Width | 6.9?mm?[?.272?in?] |
Contact Base Material | Copper Alloy |
Contact Current Rating (Max) | 11.5 |
Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
Contact Mating Area Plating Material Thickness | 30 |
Contact Shape | Dual Beam |
Contact Type | Socket |
Data Rate | 10 |
Header Type | Shrouded |
Housing Color | Black |
Housing Material | LCP (Liquid Crystal Polymer) |
Impedance, Number of Positions, Number of Signal Positions | 76 |
Mating Alignment Type | Polarized |
Mating Alignment, PCB Mount Alignment | With |
Mating Retention, PCB Mount Retention | Without |
Number of Columns | 38 |
Number of Power Positions, Number of Rows, Operating Voltage | 2 |
Operating Temperature Range | -55 ? 125??C?[?-67 ? 257??F?] |
Packaging Method | Box & Tube, Tube |
Packaging Quantity | 14 |
PCB Connector Assembly Type | PCB Mount Receptacle |
PCB Contact Termination Area Plating Material | Tin-Lead |
PCB Mount Orientation | Vertical |
Sealable, Stackable | No |
Stack Height | .9, 6.6, 9, 10.92, 12.57, 17.96, 18.75, 20, 22.86 |
Termination Method to Printed Circuit Board | Hybrid Surface Mount |
UL Flammability Rating | UL 94V-0 |