| Agency/Standard | Signal |
| Assembly Process Feature | 50.8?mm?[?1.9999?in?] |
| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch) | Board Mount |
| Centerline (Pitch), Housing Material | .64?mm?[?.025?in?] |
| Circuit Application | -55 ? 125??C?[?-67 ? 257??F?] |
| Connector | Printed Circuit Board |
| Connector Height | LCP (Liquid Crystal Polymer) |
| Connector Length | 6.6, 9, 10.92, 12.57, 17.96, 18.75, 20, 22.86 |
| Connector Mounting Type, Mating Alignment Type | Without |
| Connector System | Board-to-Board |
| Connector Width | Black |
| Contact Base Material, UL File Number | Yes |
| Contact Current Rating (Max) | Socket |
| Contact Layout | 150 ? 250 |
| Contact Mating Area Plating Material | Dual Beam |
| Contact Mating Area Plating Material Thickness | Gold or Palladium Nickel or Performance Based |
| Contact Shape | Tin-Lead |
| Contact Type, Data Rate, Operating Voltage | 30 |
| CSA Certified | UL 94V-0 |
| CSA File Number | CSA |
| Differential Signaling | 10 |
| Header Type | Shrouded |
| Housing Color | Locating Posts |
| Impedance, Number of Positions, Number of Signal Positions | 114 |
| Insulation Resistance, Number of Rows | 2 |
| Mating Alignment | Hybrid Surface Mount |
| Mating Retention, Termination Method to Printed Circuit Board | Inline |
| Number of Columns | 57 |
| Number of Power Positions, Operating Voltage | 3 |
| Operating Temperature Range | .9 |
| Packaging Method | Listed |
| Packaging Quantity | E28476 |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Copper Alloy |
| PCB Contact Termination Area Plating Material Thickness | 11.5 |
| PCB Mount Alignment | Polarized |
| PCB Mount Alignment Type, PCB Mount Retention | With |
| PCB Mount Orientation | Vertical |
| Sealable, Stackable | No |
| Stack Height | 6.096?mm?[?.24?in?], 6.9?mm?[?.272?in?] |
| UL Flammability Rating | None |
| UL Rating | 1195944 |