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TE Connectivity (TE) 3-2267065-1

Attributes

Key ^Value
Centerline (Pitch)Thermoplastic
Centerline (Pitch), High Temperature Housing, Housing Color2.54?mm?[?.1?in?]
ConnectorPrinted Circuit Board
Connector Contact Load ConditionFully Loaded
Connector ProfileStandard
Contact Base MaterialPhosphor Bronze
Contact Mating Area Plating MaterialGold
Contact ShapeSquare
Contact TypePin
Contact Underplating MaterialNickel
Header TypeUnshrouded
High Temperature Compatible, Sealable, Solder Process FeatureNo
Housing Material, Mating Alignment, Strain ReliefWithout
Mating Post Length, Termination Post.278
Number of Positions62
Number of Rows2
Panel Mount FeatureWith
PCB Connector Assembly TypePCB Mount Header
PCB Contact Termination Area Plating MaterialTin
PCB Contact Termination Area Plating Material FinishMatte
PCB Contact Termination Area Plating Material Thickness2.54 ? 5.08??m?[?100 ? 200??in?]
PCB Mount OrientationVertical
PCB Mount RetentionRetention Solder Tails
PCB Mount Retention TypeThrough Hole - Solder
Position Locations OmittedBoard Standoff
Post Size.63?mm?[?.0248?in?]
Row-to-Row SpacingBlack
Termination Method to Printed Circuit Board3.175?mm?[?.125?in?]