Board-to-Board Configuration | Mezzanine |
Boss, Differential Signaling, Stackable | Yes |
Busbar Mating Area Plating Thickness, Dielectric Withstanding Voltage | 500 |
Centerline (Pitch) | .64, 24.003, .945 |
Connector & Contact Terminates To | Printed Circuit Board |
Connector System | Board-to-Board |
Contact Base Material | Copper Alloy |
Contact Configuration | Dual Beam |
Contact Current Rating (Max) | 11.5 |
Contact Layout | Inline |
Contact Mating Area Plating Material | Palladium Nickel |
Contact Mating Area Plating Material Finish, Solder Tail Contact Plating Material Finish | Matte |
Contact Mating Area Plating Thickness?:</span> <em class="feature-value">.76??m?[?29.9212??in | .76??m?[?29.9212??in?] |
Data Rate | 10 |
Impedance, Number of Positions, Number of Signal Positions | 38 |
Insulation Resistance, Number of Rows | 2 |
Mating Alignment | With |
Number of Columns | 19 |
Number of Power Positions, Voltage | 1 |
PCB Connector Assembly Type | PCB Mount Header |
PCB Contact Termination Area Plating Material | Tin |
PCB Contact Termination Area Plating Thickness?:</span> <em class="feature-value">3.81 ? 6.35??m?[?149.9997 ? 249.9995??in | 3.81 ? 6.35??m?[?149.9997 ? 249.9995??in?] |
PCB Mount Orientation | Vertical |
Product Type | Connector |
Sealable | No |
Series | MICTOR |
Termination Method to Printed Circuit Board | Surface Mount |
Voltage | 30 |