| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch)?:</span> <em class="feature-value">.64?mm?[?.025?in | .64?mm?[?.025?in?] |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Configuration | Dual Beam |
| Contact Current Rating (Max) | 11.5 |
| Contact Layout | Inline |
| Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
| Contact Mating Area Plating Thickness?:</span> <em class="feature-value">.12??m?[?5??in | .12??m?[?5??in?] |
| Contact Type | Socket |
| Data Rate | 10 |
| Differential Signaling | Yes |
| Impedance | 266 |
| Insulation Resistance | 2 |
| Mating Alignment | With |
| Mating Alignment Type | Polarization |
| Mating Retention | Without |
| Number of Columns | 133 |
| Number of Positions | 266 |
| Number of Power Positions | 7 |
| Number of Rows | 2 |
| Number of Signal Positions | 266 |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Mount Alignment | With |
| PCB Mount Alignment Type | Locating Posts |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | Without |
| Product Type | Connector |
| Sealable | No |
| Series | MICTOR |
| Stackable | No |
| Termination Method to Printed Circuit Board | Hybrid Surface Mount |
| Tin to Lead Ratio | 60 / 40 |
| Voltage | 30, 7 |