| Board-to-Board Configuration | Mezzanine |
| Boss | No |
| Centerline (Pitch) | .64, 24.003, .945 |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Configuration | Dual Beam |
| Contact Current Rating (Max) | 11.5 |
| Contact Layout | Inline |
| Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
| Contact Mating Area Plating Thickness?:</span> <em class="feature-value">.76??m?[?30??in | .76??m?[?30??in?] |
| Contact Type | Socket |
| Data Rate | 10 |
| Differential Signaling | Yes |
| Impedance | 114 |
| Insulation Resistance | 2 |
| Mating Alignment | With |
| Mating Alignment Type | Polarization |
| Number of Columns | 57 |
| Number of Positions | 114 |
| Number of Power Positions | 3 |
| Number of Rows | 2 |
| Number of Signal Positions | 114 |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Contact Termination Area Plating Thickness | 150 ? 250 |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention Type | Boardlock |
| Product Type | Connector |
| Sealable | No |
| Series | MICTOR |
| Stackable | No |
| Termination Method to Printed Circuit Board | Hybrid Surface Mount |
| Tin to Lead Ratio | 60 / 40 |
| Voltage | 3, 30 |