Assembly Process Feature | None |
Board-to-Board Configuration | Mezzanine |
Category | Connectors, Interconnects |
Centerline (Pitch) | .64?mm?[?.025?in?] |
Circuit Application | Signal |
Connector | Printed Circuit Board |
Connector Height | 6.096?mm?[?.24?in?] |
Connector Mounting Type | Board Mount |
Connector System | Board-to-Board |
Connector Type, Impedance, Number of Positions, Number of Signal Positions | 76 |
Connector Width | 6.9?mm?[?.272?in?] |
Contact Base Material | Copper Alloy |
Contact Current Rating (Max) | 11.5 |
Contact Finish | 30.0?in (0.76?m) |
Contact Finish Thickness | 6.6mm, 9mm, 10.92mm, 12.57mm, 17.96mm, 18.75mm, 20mm, 22.86mm |
Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
Contact Mating Area Plating Material Thickness | 30 |
Contact Shape | Dual Beam |
Contact Type | Socket |
Country of Origin (subject to change) | United States |
Data Rate | 10 |
Features | Gold |
Header Type | Shrouded |
Height Above Board, Number of Power Positions, Number of Rows, Operating Voltage | 2 |
Housing Color | Black |
Housing Material | LCP (Liquid Crystal Polymer) |
Mated Stacking Heights | 0.236" (6.00mm) |
Mating Alignment Type | Polarized |
Mating Alignment, PCB Mount Alignment | With |
Mating Retention, PCB Mount Retention | Without |
Mfr | TE Connectivity AMP Connectors |
Mounting Type | Board Guide, Ground Bus (Plane) |
Number of Columns | 38 |
Number of Positions | 0.025" (0.64mm) |
Operating Temperature Range | -55 ? 125??C?[?-67 ? 257??F?] |
Package | Active |
Packaging Method | Box & Tube, Tube |
Packaging Quantity | 14 |
Part Status | Receptacle, Center Strip Contacts |
PCB Connector Assembly Type | PCB Mount Receptacle |
PCB Contact Termination Area Plating Material | Tin-Lead |
PCB Mount Orientation | Vertical |
Pitch | Surface Mount |
Sealable, Stackable | No |
Series | Tube |
Stack Height | .9, 6.6, 9, 10.92, 12.57, 17.96, 18.75, 20, 22.86 |
Termination Method to Printed Circuit Board | Hybrid Surface Mount |
UL Flammability Rating | UL 94V-0 |