Attributes

Key Value
CategorySoldering, Desoldering,.
CompositionSn96.5Ag3Cu0.5 (96.5/3/.
Diameter0.022" (0.56mm)
Flux TypeNo-Clean
FormSpool, 8.8 oz (250g)
Melting Point423?F (217?C)
MfrHarimatec Inc.
PackageBulk
ProcessLead Free
Product StatusActive
SeriesC400
Shelf Life-
Shelf Life Start-
Shipping Info-
Storage/Refrigeration T.59?F ~ 86?F (15?C ~ 30?.
TypeWire Solder
Weight0.55 lb (249.48 g)
Wire Gauge23 AWG, 24 SWG
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