| Key ^ | Value |
|---|---|
| In-stock | 89 |
| Moisture Sensitivity Level | 1 |
| Number of Terminals | 785 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Shape | UNSPECIFIED |
| Package Style | GRID ARRAY |
| Package/Case | BGA1156 |
| Peak Reflow Temperature (Cel) | 225 |
| Product Categories | Telecom |
| Qualification Status | Not Qualified |
| RoHs Status | Lead free / RoHS Compliant |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature Max (s) | NOT SPECIFIED |