Key ^ | Value |
---|---|
In-stock | 89 |
Moisture Sensitivity Level | 1 |
Number of Terminals | 785 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Shape | UNSPECIFIED |
Package Style | GRID ARRAY |
Package/Case | BGA1156 |
Peak Reflow Temperature (Cel) | 225 |
Product Categories | Telecom |
Qualification Status | Not Qualified |
RoHs Status | Lead free / RoHS Compliant |
Surface Mount | YES |
Technology | CMOS |
Terminal Form | BALL |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature Max (s) | NOT SPECIFIED |