Attributes

Key Value
Base Product NumberNCSW
CategorySoldering, Desoldering,.
CompositionSn96.5Ag3Cu0.5 (96.5/3/.
Diameter0.015" (0.38mm)
Flux TypeNo-Clean
FormSpool, 1 oz (28.35g)
Melting Point423 ~ 428?F (217 ~ 220?.
MfrChip Quik Inc.
PackageBulk
Process-
Product StatusActive
SeriesCHIPQUIK?
Shelf Life-
Shelf Life Start-
Shipping Info-
Storage/Refrigeration T.-
TypeWire Solder
Weight-
Wire Gauge-
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