B0937J6Z4X

Chip Quik TS391SNL Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (15g syringe)

Attributes

Key Value
Base Product NumberTS391S
CategorySoldering, Desoldering,.
CompositionSn96.5Ag3Cu0.5 (96.5/3/.
Diameter-
Flux TypeNo-Clean
FormSyringe, 0.53 oz (15g),.
Melting Point423 ~ 428?F (217 ~ 220?.
Mesh Type4
MfrChip Quik Inc.
PackageBulk
ProcessLead Free
Product StatusActive
Series-
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Shipping Info-
Storage/Refrigeration T.68?F ~ 77?F (20?C ~ 25?.
TypeSolder Paste
Wire Gauge-
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