Attributes

Key Value
Appearancegel
Applicationsealing and tightening
Bonding time60min
Colourtransparent
Curing methodRTV
Dielectric strength18.5kV/mm
InformationProduct is intended for.
ManufacturerCHT
Mix ratio1:1
Net weight2kg
Operating temperature-55...200?C
Resistivity20T?m
Thermal conductivity0.18W/mK
Type of chemical agentsilicone encapsulating .
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