| Key ^ | Value |
|---|---|
| Chipset Validation, Product Longevity Program Start Date | N/A |
| FBGA_Code | NW197 |
| In-stock | 33 |
| Op. Temp. | 0C to +70C |
| Package/Case | BGA |
| Pin Count | 63-ball |
| Product Categories | NAND Flash ; SLC NAND |
| Product Longevity Program | No |
| RoHs Status | Lead free/RoHS Compliant |