Attributes

Key Value
Assembly Process Feature10?mm?[?.393?in?]
Board-to-Board Configur.Vertical
Centerline (Pitch)1.27?mm?[?.05?in?], Boa.
Circuit Application-55 ? 85??C?[?-67 ? 185.
ConnectorPrinted Circuit Board
Connector HeightBlack
Connector Mounting TypeWith
Connector Profile750
Connector SystemBoard-to-Board
Contact Base MaterialBrass
Contact Current Rating .Socket
Contact Layout3.8??m?[?149.606??in?]
Contact Mating Area Pla.Matte
Contact Mating Area Pla.Tin
Contact Mating Area Pla.Gold Flash
Contact Type30
Dielectric Withstanding.4
Housing ColorLocating Posts
Housing Material1.27?mm?[?.05?in?]
Insulation Resistance4
Mating AlignmentThrough Hole - Solder
Mating Alignment TypeBoardlock, Retention Leg
Number of Positions100
Number of Rows4
Operating Temperature R.Matte
Operating Voltage250
Packaging MethodUL 94V-0
Packaging QuantitySignal
PCB Connector Assembly .PCB Mount Receptacle
PCB Contact Termination.Phosphor Bronze
PCB Contact Termination.Matte
PCB Contact Termination.1
PCB Mount AlignmentPolarized
PCB Mount Alignment TypeWith
PCB Mount OrientationVertical
PCB Mount RetentionWith
PCB Mount Retention Type2.54?mm?[?.1?in?]
PCB Retention Feature M.Tin-Copper over Nickel
PCB Retention Feature P.Standard
SealableNo
StackableNo
Termination Method to P.Matrix
Termination PostMatrix
UL Flammability RatingNone
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