| Assembly Process Feature | Vacuum Cover |
| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch) | .6?mm?[?.024?in?] |
| Circuit Application | Signal |
| Connector | Printed Circuit Board |
| Connector Height | 8?mm?[?.314?in?] |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | .5 |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Material Thickness | .2??m?[?7.874??in?] |
| Contact Type | Pin |
| Ground Component Type | Grounding Contact, Grounding Plate |
| Housing Color | Black |
| Housing Material | High Temperature Thermoplastic |
| Mating Alignment Type | Polarization |
| Mating Alignment, PCB Mount Alignment, PCB Mount Retention | With |
| Number of Positions | 280 |
| Number of Rows | 2 |
| Operating Temperature Range | -40 ? 85??C?[?-40 ? 185??F?] |
| Packaging Method | Tape |
| Packaging Quantity | 400 |
| PCB Connector Assembly Type | PCB Mount Header |
| PCB Contact Termination Area Plating Material | Tin |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention Type | Solder Peg |
| PCB Thickness (Recommended) | .2 |
| Stack Height | .63, 8, 16 |
| Stackable | Yes |
| Termination Method to Printed Circuit Board | Surface Mount |
| UL Flammability Rating | UL 94V-0 |