mpn
2199154-4
brand
name: TE Connectivity (TE)
manufacturer
name: TE Connectivity (TE)
Attributes
Key
Value
Boardlock Material
Stainless Steel
Center Key
Offset Right
Center Post
With
Center Retention Hole D.
1.2?mm?[?.047?in?]
Centerline (Pitch)
.85?mm?[?.0334?in?]
Circuit Application
Signal
Connector
Printed Circuit Board
Connector Mounting Type
Board Mount
Connector System
Board-to-Board
Contact Base Material
Copper Alloy
Contact Current Rating .
.75
Contact Mating Area Pla.
Gold
Contact Mating Area Pla.
.76??m?[?30??in?]
Contact Underplating Ma.
Nickel
DRAM Type
Double Data Rate (DDR) 4
DRAM Voltage
1.2
Ejector Location
Both Ends
Ejector Material
High Temperature Thermo.
Ejector Material Color
Black
Ejector Type
Standard
Height Above PC Board
20?mm?[?.787?in?]
Housing Color
Black
Housing Material
High Temperature Nylon
Insertion Style
Direct Insert
Keying
Standard
Latch Color
Black
Latch Material
High Temperature Thermo.
Locating Posts
Without
Module Key Type
Offset Right
Module Orientation
Vertical
Mounting Angle
Vertical
Number of Bays
2
Number of Keys
1
Number of Positions
288
Number of Rows
2
Operating Temperature R.
-55 ? 105??C?[?-67 ? 22.
Packaging Method
Box & Tray, Tray
Packaging Quantity
80
PCB Contact Termination.
Tin
PCB Mount Retention
With
PCB Mount Retention Type
Boardlock
PCB Mounting Style
Through Hole
Product Type
Socket
Retention Post Location
None
Retention Post Material
Stainless Steel
Row-to-Row Spacing
2.2?mm?[?.08?in?]
Sealable
No
Socket Style
DIMM
Socket Type
Memory Card
Solder Tail Contact Pla.
3??m?[?118.1??in?]
Termination Post Length
2.67?mm?[?.105?in?]
UL Flammability Rating
UL 94V-0