| Board-to-Board Configuration | Mezzanine |
| Boss, Sealable, Stackable | No |
| Centerline (Pitch)?:</span> <em class="feature-value">.64?mm?[?.025?in | .64?mm?[?.025?in?] |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector System | Board-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Configuration | Dual Beam |
| Contact Current Rating (Max) | 11.5 |
| Contact Layout | Inline |
| Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
| Contact Mating Area Plating Thickness, Voltage | 30 |
| Contact Type | Socket |
| Data Rate | 10 |
| Differential Signaling | Yes |
| Header Type | Shrouded |
| Impedance, Number of Positions, Number of Signal Positions | 152 |
| Insulation Resistance, Number of Rows | 2 |
| Mating Alignment | With |
| Mating Alignment Type | Polarization |
| Number of Columns | 76 |
| Number of Power Positions, Voltage | 4 |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Contact Termination Area Plating Thickness | 150 ? 250 |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | Without |
| Product Type | Connector |
| Series | MICTOR |
| Termination Method to Printed Circuit Board | Hybrid Surface Mount |
| Tin to Lead Ratio | 60 / 40 |