| Assembly Process Feature | Pick and Place Cover |
| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch) | .64, 24.003, .945 |
| Circuit Application | Signal |
| Connector | Printed Circuit Board |
| Connector Height | 6.096?mm?[?.24?in?] |
| Connector Mounting Type | Board Mount |
| Connector System | Board-to-Board |
| Connector Width | 6.9?mm?[?.272?in?] |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | 11.5 |
| Contact Mating Area Plating Material | Gold or Palladium Nickel or Performance Based |
| Contact Mating Area Plating Material Thickness | .76??m?[?30??in?] |
| Contact Shape | Dual Beam |
| Contact Type | Socket |
| Data Rate | 10 |
| Ground Component Type | Ground Bus |
| Header Type | Header Only |
| Housing Color | Black |
| Housing Material | Liquid Crystal Polymer |
| Impedance | 50 |
| Mating Alignment | With |
| Mating Entry Location | Bottom |
| Mating Retention | With |
| Number of Columns | 19 |
| Number of Positions | 38 |
| Number of Power Positions | 1 |
| Number of Rows | 2 |
| Number of Signal Positions | 38 |
| Operating Temperature Range | -55 ? 125??C?[?-67 ? 257??F?] |
| Operating Voltage | 1 |
| Packaging Method | Tape |
| Packaging Quantity | 252 |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| PCB Mount Alignment | With |
| PCB Mount Orientation | Vertical |
| PCB Mount Retention | With |
| PCB Thickness (Recommended) | 1.57?mm?[?.8?in?] |
| Row-to-Row Spacing | 5.79?mm?[?.227547?in?] |
| Sealable | No |
| Stack Height | .9, 6.6, 9, 10.92, 12.57, 17.96, 18.75, 20, 22.86 |
| Stackable | No |
| Termination Method to Printed Circuit Board | Hybrid Surface Mount |
| UL Flammability Rating | UL 94V-0 |