| Board-to-Board Configuration | Mezzanine |
| Centerline (Pitch) | Post Polarization, Top |
| Centerline (Pitch), Housing Color | 1.27, 3.04, 6.09 |
| Centerline (Pitch), Housing Material | .05, .12, .24 |
| Circuit Application | .06?mm?[?.8?in?] |
| Connector | Printed Circuit Board |
| Connector Height | Black |
| Connector Mounting Type, PCB Mount Alignment, PCB Mount Alignment Type, PCB Mount Retention | With |
| Connector System | Board-to-Board |
| Contact Base Material | 16 |
| Contact Current Rating (Max) | Pin |
| Contact Layout | .5 ? 2.54??m?[?19.68 ? 100??in?] |
| Contact Mating Area Plating Material | Matte |
| Contact Mating Area Plating Material Thickness | Gold Flash |
| Contact Type | .076??m?[?3??in?] |
| Data Rate | 750 |
| Dielectric Withstanding Voltage (Max), Insulation Resistance | 1000 |
| Header Type | Header Only |
| Impedance | 100 |
| Mating Alignment | Through Hole - Press-Fit |
| Mating Entry Location | Board Mount |
| Mating Retention | 1.45?mm?[?.057?in?] |
| Number of Loaded Positions, Number of Positions | 291 |
| Number of Pairs | 88 |
| Number of Power Positions, Operating Voltage | 0 |
| Number of Signal Positions, Pairs per Column | 8 |
| Operating Temperature Range | 25?mm?[?.984?in?] |
| Operating Voltage | 250 |
| PCB Connector Assembly Type | PCB Mount Header |
| PCB Contact Termination Area Plating Material | Copper Alloy |
| PCB Contact Termination Area Plating Material Finish | Tin |
| PCB Contact Termination Area Plating Material Thickness | 1.5 |
| PCB Mount Orientation | Vertical |
| PCB Thickness (Recommended) | 24.8?mm?[?.976?in?] |
| Sealable, Stackable | No |
| Solder Process Feature | -55 ? 85??C?[?-67 ? 185??F?] |
| Stack Height | LCP (High Temp Thermoplastic) |
| Termination Method to Printed Circuit Board, Termination Post | Staggered |
| UL Flammability Rating | Power & Signal |