mpn
W66BL6NBUAHJ
brand
name: Winbond Electronics
manufacturer
name: Winbond Electronics
Attributes
Key
Value
Access Time
3.5 ns
Category
Integrated Circuits (IC.
Clock Frequency
2.133 GHz
Memory Format
DRAM
Memory Interface
LVSTL_11
Memory Size
2Gb (128M x 16)
Memory Type
Volatile
Mfr
Winbond Electronics
Mounting Type
Surface Mount
Operating Temperature
-40?C ~ 105?C (TC)
Package
Tray
Package / Case
200-WFBGA
Product Status
Active
Series
-
Supplier Device Package
200-WFBGA (10x14.5)
Technology
SDRAM - Mobile LPDDR4
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.
Write Cycle Time - Word.
18ns