mpn
K4B2G0846C-HCH9
brand
name: Samsung Semiconductor
manufacturer
name: Samsung Semiconductor
Attributes
Key
Value
Clock Frequency-Max (fC.
667 MHz
Direct Alternates
K4B2G0846C-HCH90
I/O Type
COMMON
Interleaved Burst Length
8
JESD-30 Code
R-PBGA-B78
JESD-609 Code
e1
Manufacturer
Samsung Semiconductor
Manufacturer Part Number
K4B2G0846C-HCH9
Memory Density
2.1475 Gbit
Memory IC Type
DDR DRAM
Memory Width
8
Number of Terminals
78
Number of Words
268.4355 M
Number of Words Code
256000000
Operating Temperature-M.
85 ?C
Operating Temperature-M.
0 ?C
Organization
256MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Package Description
FBGA, BGA78,9X13,32
Package Equivalence Code
BGA78,9X13,32