Attributes

Key Value
Attachment MethodEpoxy or Solder
Base Product NumberATS-HP-F9
CategoryFans, Thermal Management
Diameter-
Features-
Height0.177" (4.50mm)
Length7.874" (200.00mm)
MaterialCopper
MfrAdvanced Thermal Soluti.
Minimum Bend Radius-
Operating Temperature30?C ~ 120?C
PackageBulk
Platform-
Power - Cooling91.0W @ 200mm
Product StatusActive
Series-
ShapeFlat
Thermal Resistance-
TypeHeat Pipe
Wick TypeSintered
Width0.413" (10.50mm)
Working FluidDistilled Water
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