Chip Quik TS991SNL35T3 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (35g syringe)

mpnTS991SNL35T3
brandname: Chip Quik Inc.
manufacturername: Chip Quik Inc.

Chip Quik TS991SNL35T3 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (35g syringe)

Model: TS991SNL35T3
Manufacturer: Chip Quik?

Attributes

Key	Value
Category	Soldering, Desoldering,.
Composition	Sn96.5Ag3Cu0.5 (96.5/3/.
Diameter	-
Flux Type	No-Clean
Form	Syringe, 1.23 oz (34.86.
Melting Point	423?F (217?C)
Mesh Type	3
Mfr	Chip Quik Inc.
Package	Bulk
Process	-
Product Status	Active
Series	CHIPQUIK?
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Shipping Info	-
Storage/Refrigeration T.	37?F ~ 77?F (3?C ~ 25?C)
Type	Solder Paste
Weight	-
Wire Gauge	-

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