AttributeKey09: Lead Free Solder Processes

Products with this attribute (6 total)

1-1437381-7 TE Connectivity Always EU RoHS/ELV Compliant Not applicable for solder process capability

1-1542005-3 TE Connectivity Heat Sink; BGA; Package Size = 21 [.827] mm [in]; For Use With BGA Semiconductor Packages; Power Air Velocity Thermal Resistance;

1-208597-0 TE Connectivity Not reviewed for RoHS Compliance Not reviewed for solder process capability

1-208599-1 TE Connectivity Not Sealed; Shell Size = 1; Shell Configuration = Receptacle; Contact Arrangement (Module A) = 60; Contact Arrangement (Module B) = 60;

5-1393670-5 TE Connectivity Connector; Plug; Without Panel Attachment; Coupler Type = A (Screw); Connector Impedance = 75 Ω;

5228686-1 TE Connectivity Connector; Jack; Terminate To Printed Circuit Board; PCB Mount Angle = Right Angle; With Panel Attachment;