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MBB22-60 | Ball Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI

MISUMI . MBB22-60

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Attributes

Brand name, Manufacturer name, ManufacturerMISUMI
Attribute00Bushing only
AttributeKey00Set/Single Item/Accessory
Extra Product NameMBB22-60 | Ball Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI
extendedLead3
keywordsMISUMI,Ball Guide Bushings for Die Sets - Devcon Adhesive,Ball Guide Bushings for Die Sets,Guide Posts & Bushings for Die Sets,Guide Components,Press Die Components,Plastic Mold, MISUMI catalog, e-catalog, Web Ordering System, Online Ordering,MBB22-60
moq, multiple, tierMinQty11
MPN, SKUMBB22-60
qtyInStock-2
qtySourcefixQty3
snippetShop Ball Guide Bushings for Die Sets - Devcon Adhesive from MISUMI (MBB22-60). MISUMI USA has all of your Ball Guide Bushings for Die Sets needs covered, with over 3.8M high quality products and 80 sextillion configurable parts available with fast shipping and low pricing.
tierMinQty210
tierMinQty320
tierPrice129.02
tierPrice227.55
tierPrice326.11

Distributor offers

SellerSKUMOQIn stockMultiplePrices
Misumi USAMBB22-601-211 @ $29.02, 10 @ $27.55, 20 @ $26.11