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MDB25-60 | Plain Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI

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Attributes

Brand name, Manufacturer name, ManufacturerMISUMI
Attribute00Bushing only
Attribute01Devcon adhesive
AttributeKey00Set/Single Item/Accessory
AttributeKey01Bushing Mounting Method
Extra Product NameMDB25-60 | Plain Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI
extendedLead3
keywordsMISUMI,Plain Guide Bushings for Die Sets - Devcon Adhesive,Plain Guide Bushings for Die Sets,Guide Posts & Bushings for Die Sets,Guide Components,Press Die Components,Plastic Mold, MISUMI catalog, e-catalog, Web Ordering System, Online Ordering,MDB25-60
moq, multiple, tierMinQty11
MPN, SKUMDB25-60
qtyInStock-2
qtySourcefixQty3
tierMinQty210
tierMinQty320
tierPrice128.56
tierPrice227.14
tierPrice325.71

Distributor offers

SellerSKUMOQIn stockMultiplePrices
Misumi USAMDB25-601-211 @ $28.56, 10 @ $27.14, 20 @ $25.71