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MDB38-100 | Plain Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI

MISUMI . MDB38-100

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Attributes

Brand name, Manufacturer name, ManufacturerMISUMI
Attribute00Bushing only
Attribute01Devcon adhesive
AttributeKey00Set/Single Item/Accessory
AttributeKey01Bushing Mounting Method
Extra Product NameMDB38-100 | Plain Guide Bushings for Die Sets - Devcon Adhesive | MISUMI | MISUMI
extendedLead3
keywordsMISUMI,Plain Guide Bushings for Die Sets - Devcon Adhesive,Plain Guide Bushings for Die Sets,Guide Posts & Bushings for Die Sets,Guide Components,Press Die Components,Plastic Mold, MISUMI catalog, e-catalog, Web Ordering System, Online Ordering,MDB38-100
moq, multiple, tierMinQty11
MPN, SKUMDB38-100
qtyInStock-2
qtySourcefixQty3
snippetShop Plain Guide Bushings for Die Sets - Devcon Adhesive from MISUMI (MDB38-100). MISUMI USA has all of your Plain Guide Bushings for Die Sets needs covered, with over 3.8M high quality products and 80 sextillion configurable parts available with fast shipping and low pricing.
tierMinQty210
tierMinQty320
tierPrice147.84
tierPrice245.45
tierPrice343.06

Distributor offers

SellerSKUMOQIn stockMultiplePrices
Misumi USAMDB38-1001-211 @ $47.84, 10 @ $45.45, 20 @ $43.06